TY  - CHAP
U1  - Konferenzveröffentlichung
A1  - Christ, Andreas
A1  - Hartnagel, Hans L.
T1  - Field-Theoretical Analysis of MIC Packaging Structures with a Three-Dimensional Finite-Difference Method and Modelling by Equivalent Circuits for CAD Application
T2  - 17th European Microwave Conference
N2  - Structures for interconnecting active microwave semiconductor-devices, e.g. FET's and MIC's, with the electrical surrounding or with each other have to be designed more and more carefully when increasing the desired upper frequency limit. Therefore, several connecting structures for device embedding have been examined. Mainly, their applicability for the frequency range from 10 GHz to 100 GHz was considered. Additionally, different equivalent circuits were developed to approximately describe their behaviour for CAD-applications.
KW  - Finite difference methods
KW  - Microwave integrated circuits
KW  - Equivalent circuits
KW  - Frequency
KW  - Semiconductor device packaging
KW  - Design automation
KW  - Integrated circuit interconnections
KW  - Microwave devices
KW  - FETs
KW  - Joining processes
KW  - Finite-Elemente-Methode
Y1  - 1987
UR  - https://ieeexplore.ieee.org/document/4132414
U6  - https://doi.org/10.1109/EUMA.1987.333680
DO  - https://doi.org/10.1109/EUMA.1987.333680
SP  - 647
EP  - 652
PB  - IEEE
ER  -