TY  - CPAPER
U1  - Konferenzveröffentlichung
A1  - Sikora, Axel
A1  - Sowieja, Fabian
A1  - Elayanithottathil, Jubin Sebastian
A1  - Schappacher, Manuel
A1  - Hadrich, Wacime
T1  - Automated Physical TestBeds (APTB 2.0): Enabling Reliable and Efficient Testing of Wireless Communication Networks for IoT and Industry 4.0
T2  - 2023 IEEE 21st International Conference on Industrial Informatics : INDIN 2023
N2  - Wireless communication networks are crucial for enabling megatrends like the Internet of Things (IoT) and Industry 4.0. However, testing these networks can be challenging due to the complex network topology and RF characteristics, requiring a multitude of scenarios to be tested. To address this challenge, the authors developed and extended an automated testbed called Automated Physical TestBed (APTB). This testbed provides the means to conduct controlled tests, analyze coexistence, emulate multiple propagation paths, and model dependable channel conditions. Additionally, the platform supports test automation to facilitate efficient and systematic experimentation. This paper describes the extended architecture, implementation, and performance evaluation of the APTB testbed. The APTB testbed provides a reliable and efficient solution for testing wireless communication networks under various scenarios. The implementation and performance verification of the testbed demonstrate its effectiveness and usefulness for researchers and industry practitioners.
KW  - Wireless IoT
KW  - Testbed
KW  - Performance evaluation
KW  - Radio frequency
Y1  - 2023
UR  - https://ieeexplore.ieee.org/document/10218143
SN  - 2378-363X (Elektronisch)
SS  - 2378-363X (Elektronisch)
SN  - 1935-4576 (Print on Demand)
SS  - 1935-4576 (Print on Demand)
SN  - 978-1-6654-9313-0 (Elektronisch)
SB  - 978-1-6654-9313-0 (Elektronisch)
SN  - 978-1-6654-9314-7 (Print on Demand)
SB  - 978-1-6654-9314-7 (Print on Demand)
U6  - https://doi.org/10.1109/INDIN51400.2023.10218143
DO  - https://doi.org/10.1109/INDIN51400.2023.10218143
SP  - 1
EP  - 7
PB  - IEEE
ER  -