Security Enhanced Hybrid Electronic System in Foil for Temperature Sensing
- Printed electronics can add value to existing products by providing new smart functionalities, such as sensing elements over large-areas on flexible or non-conformal surfaces. Here we present a hardware concept and prototype for a thinned ASIC integrated with an inkjet-printed temperature sensor alongside in-built additional security and unique identification features. The hybrid system exploitsPrinted electronics can add value to existing products by providing new smart functionalities, such as sensing elements over large-areas on flexible or non-conformal surfaces. Here we present a hardware concept and prototype for a thinned ASIC integrated with an inkjet-printed temperature sensor alongside in-built additional security and unique identification features. The hybrid system exploits the advantages of inkjet-printable platinum-based sensors, physically unclonable function circuits and a fluorescent particle-based coating as a tamper protection layer.…
| Document Type: | Conference Proceeding |
|---|---|
| Conference Type: | Konferenzartikel |
| Zitierlink: | https://opus.hs-offenburg.de/8345 | Bibliografische Angaben |
| Title (English): | Security Enhanced Hybrid Electronic System in Foil for Temperature Sensing |
| Conference: | IEEE International Flexible Electronics Technology Conference (5. : 13-16 August 2023 : San Jose, CA, USA) |
| Author: | Alexander Scholz ORCiD, Tim Wolfer, Martin FriedrichORCiDGND, Björn Albrecht, Sophie Sauva, Thomas Kister, Makara Lay, Saeed AbdolinezhadORCiDGND, Wacime HadrichStaff Member, Shawon Alam, Georg Dost, Christine Harendt, Axel SikoraStaff MemberORCiDGND, Tobias Kraus, Jasmin Aghassi-HagmannORCiDGND |
| Year of Publication: | 2023 |
| Date of first Publication: | 2023/09/25 |
| Publisher: | IEEE |
| First Page: | 1 |
| Last Page: | 3 |
| Parent Title (English): | IEEE IFETC 2023 : Conference Proceedings |
| ISBN: | 979-8-3503-3209-4 (Elektronisch) |
| ISBN: | 979-8-3503-3210-0 (Print on Demand) |
| DOI: | https://doi.org/10.1109/IFETC57334.2023.10254812 |
| URL: | https://ieeexplore.ieee.org/document/10254812 |
| Language: | English | Inhaltliche Informationen |
| Institutes: | Forschung / ivESK - Institut für verlässliche Embedded Systems und Kommunikationselektronik |
| Fakultät Elektrotechnik, Medizintechnik und Informatik (EMI) (ab 04/2019) | |
| Institutes: | Bibliografie |
| Tag: | Hybrid system; Physical unclonable function; printed electronics; system authenticity; temperature sensor; thinned ASIC in foil | Formale Angaben |
| Relevance: | Konferenzbeitrag: h5-Index < 30 |
| Open Access: | Closed |
| Licence (German): |  Urheberrechtlich geschützt |