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A printed electronics technology has the advantage of additive and extremely low-cost fabrication compared with the conventional silicon technology. Specifically, printed electrolyte-gated field-effect transistors (EGFETs) are attractive for low-cost applications in the Internet-of-Things domain as they can operate at low supply voltages. In this paper, we propose an empirical dc model for EGFETs, which can describe the behavior of the EGFETs smoothly and accurately over all regimes. The proposed model, built by extending the Enz-Krummenacher-Vittoz model, can also be used to model process variations, which was not possible previously due to fixed parameters for near threshold regime. It offers a single model for all the operating regions of the transistors with only one equation for the drain current. Additionally, it models the transistors with a less number of parameters but higher accuracy compared with existing techniques. Measurement results from several fabricated EGFETs confirm that the proposed model can predict the I-V more accurately compared with the state-of-the-art models in all operating regions. Additionally, the measurements on the frequency of a fabricated ring oscillator are only 4.7% different from the simulation results based on the proposed model using values for the switching capacitances extracted from measurement data, which shows more than 2× improvement compared with the state-of-the-art model.
Printed electronics offers certain technological advantages over its silicon based counterparts, such as mechanical flexibility, low process temperatures, maskless and additive manufacturing process, leading to extremely low cost manufacturing. However, to be exploited in applications such as smart sensors, Internet of Things and wearables, it is essential that the printed devices operate at low supply voltages. Electrolyte gated field effect transistors (EGFETs) using solution-processed inorganic materials which are fully printed using inkjet printers at low temperatures are very promising candidates to provide such solutions. In this paper, we discuss the technology, process, modeling, fabrication, and design aspect of circuits based on EGFETs. We show how the measurements performed in the lab can accurately be modeled in order to be integrated in the design automation tool flow in the form of a Process Design Kit (PDK). We also review some of the remaining challenges in this technology and discuss our future directions to address them.