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In this work a set of nonlinear coupled COM equations at interacting frequencies is derived on the basis of nonlinear electro-elasticity. The formalism is presented with the aim of describing intermodulation distortion of third-order (IMD3) and triple beat. The resulting COM equations are translated to the P-matrix formalism, where care is taken to obtain the correct frequency dependence. The scheme depends on two frequency-independent constants for an effective third-order nonlinearity. One of these two constants is negligibly small in the systems considered here. The P-matrix approach is applied to single filters and duplexers on LiTaO 3 (YXl)/42° operating in different frequency ranges. Both IMD3 and triple beat show good agreement with measurement.
A Nonlinear FEM Model to Calculate Third-Order Harmonic and Intermodulation in TC-SAW Devices
(2018)
Nonlinearities in Temperature Compensated SAW (TC-SAW) devices in the 2 GHz range are investigated using a nonlinear finite element model by simultaneously considering both third-order intermodulation distortion (IMD3)and third harmonic (H3). In the employed perturbation approach, different contributions to the total H3, the direct and indirect contribution, are discussed. H3 and IMD3 measurements were fitted simultaneously using scaling factors for SiO 2 film and Cu electrode nonlinear material tensors in TC-SAW devices. We employ a P-Matrix simulation as intermediate step: Firstly, measurement and nonlinear P-Matrix calculations for finite devices are compared and coefficients of the P-Matrix simulation are determined. The nonlinear tensor data of the different materials involved in periodic nonlinear finite element method (FEM) computations are optimized to fit periodic P-Matrix calculations by introducing scaling factors. Thus, the contribution of different materials to the nonlinear behavior of TC-SAW devices is obtained and the role of materials is discussed.
Analysis of Miniaturized Printed Flexible RFID/NFC Antennas Using Different Carrier Substrates
(2020)
Antennas for Radio Frequency Identification (RFID) provide benefits for high frequencies (HF) and wireless data transmission via Near Field Communication (NFC) and many other applications. In this case, various requirements for the design of the reader and transmitter antennas must be met in order to achieve a suitable transmission quality. In this work, a miniaturized cost-effective RFID/NFC antenna for a microelectronic measurement system is designed and printed on different flexible carrier substrates using a new and low-cost Direct Ink Writing (DIW) technology. Various practical aspects such as reflection and impedance magnitude as well as the behavior of the printed RFID/NFC antennas are analyzed and compared to an identical copper-based antenna of the same size. The results are presented in this paper. Furthermore, the problems during the printing process itself on the different substrates are evaluated. The effects of the characteristics on the antenna under kink-free bending tests are examined and subsequently long-term measurements are carried out.
Radio frequency identification (RFID) antennas are popular for high frequency (HF) RFID, energy transfer and near field communication (NFC) applications. Particularly for wireless measurement systems the RFID/NFC technology is a good option to implement a wireless communication interface. In this context, the design of corresponding reader and transmitter antennas plays a major role for achieving suitable transmission quality. This work proves the feasibility of the rapid prototyping of a RFID/NFC antenna, which is used for the wireless communication and energy harvesting at the required frequency of 13.56 MHz. A novel and low-cost direct ink writing (DIW) technology utilizing highly viscous silver nanoparticle ink is used for this process. This paper describes the development and analysis of low-cost printed flexible RFID/NFC antennas on cost-effective substrates for a microelectronic vital parameter measurement system. Furthermore, we compare the measured technical parameters with existing copper-based counterparts on a FR4 substrate.