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High-performance Ag–Se-based n-type printed thermoelectric (TE) materials suitable for room-temperature applications have been developed through a new and facile synthesis approach. A high magnitude of the Seebeck coefficient up to 220 μV K–1 and a TE power factor larger than 500 μW m–1 K–2 for an n-type printed film are achieved. A high figure-of-merit ZT ∼0.6 for a printed material has been found in the film with a low in-plane thermal conductivity κF of ∼0.30 W m–1 K–1. Using this material for n-type legs, a flexible folded TE generator (flexTEG) of 13 thermocouples has been fabricated. The open-circuit voltage of the flexTEG for temperature differences of ΔT = 30 and 110 K is found to be 71.1 and 181.4 mV, respectively. Consequently, very high maximum output power densities pmax of 6.6 and 321 μW cm–2 are estimated for the temperature difference of ΔT = 30 K and ΔT = 110 K, respectively. The flexTEG has been demonstrated by wearing it on the lower wrist, which resulted in an output voltage of ∼72.2 mV for ΔT ≈ 30 K. Our results pave the way for widespread use in wearable devices.
Radio frequency identification (RFID) antennas are popular for high frequency (HF) RFID, energy transfer and near field communication (NFC) applications. Particularly for wireless measurement systems the RFID/NFC technology is a good option to implement a wireless communication interface. In this context, the design of corresponding reader and transmitter antennas plays a major role for achieving suitable transmission quality. This work proves the feasibility of the rapid prototyping of a RFID/NFC antenna, which is used for the wireless communication and energy harvesting at the required frequency of 13.56 MHz. A novel and low-cost direct ink writing (DIW) technology utilizing highly viscous silver nanoparticle ink is used for this process. This paper describes the development and analysis of low-cost printed flexible RFID/NFC antennas on cost-effective substrates for a microelectronic vital parameter measurement system. Furthermore, we compare the measured technical parameters with existing copper-based counterparts on a FR4 substrate.