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A versatile liquid metal (LM) printing process enabling the fabrication of various fully printed devices such as intra- and interconnect wires, resistors, diodes, transistors, and basic circuit elements such as inverters which are process compatible with other digital printing and thin film structuring methods for integration is presented. For this, a glass capillary-based direct-write method for printing LMs such as eutectic gallium alloys, exploring the potential for fully printed LM-enabled devices is demonstrated. Examples for successful device fabrication include resistors, p–n diodes, and field effect transistors. The device functionality and easiness of one integrated fabrication flow shows that the potential of LM printing is far exceeding the use of interconnecting conventional electronic devices in printed electronics.
Physically Unclonable Functions (PUFs) are hardware-based security primitives, which allow for inherent device fingerprinting. Therefore, intrinsic variation of imperfect manufactured systems is exploited to generate device-specific, unique identifiers. With printed electronics (PE) joining the internet of things (IoT), hardware-based security for novel PE-based systems is of increasing importance. Furthermore, PE offers the possibility for split-manufacturing, which mitigates the risk of PUF response readout by third parties, before commissioning. In this paper, we investigate a printed PUF core as intrinsic variation source for the generation of unique identifiers from a crossbar architecture. The printed crossbar PUF is verified by simulation of a 8×8-cells crossbar, which can be utilized to generate 32-bit wide identifiers. Further focus is on limiting factors regarding printed devices, such as increased parasitics, due to novel materials and required control logic specifications. The simulation results highlight, that the printed crossbar PUF is capable to generate close-to-ideal unique identifiers at the investigated feature size. As proof of concept a 2×2-cells printed crossbar PUF core is fabricated and electrically characterized.
Printed electronics (PE) offers flexible, extremely low-cost, and on-demand hardware due to its additive manufacturing process, enabling emerging ultra-low-cost applications, including machine learning applications. However, large feature sizes in PE limit the complexity of a machine learning classifier (e.g., a neural network (NN)) in PE. Stochastic computing Neural Networks (SC-NNs) can reduce area in silicon technologies, but still require complex designs due to unique implementation tradeoffs in PE. In this paper, we propose a printed mixed-signal system, which substitutes complex and power-hungry conventional stochastic computing (SC) components by printed analog designs. The printed mixed-signal SC consumes only 35% of power consumption and requires only 25% of area compared to a conventional 4-bit NN implementation. We also show that the proposed mixed-signal SC-NN provides good accuracy for popular neural network classification problems. We consider this work as an important step towards the realization of printed SC-NN hardware for near-sensor-processing.
Emerging applications in soft robotics, wearables, smart consumer products or IoT-devices benefit from soft materials, flexible substrates in conjunction with electronic functionality. Due to high production costs and conformity restrictions, rigid silicon technologies do not meet application requirements in these new domains. However, whenever signal processing becomes too comprehensive, silicon technology must be used for the high-performance computing unit. At the same time, designing everything in flexible or printed electronics using conventional digital logic is not feasible yet due to the limitations of printed technologies in terms of performance, power and integration density. We propose to rather use the strengths of neuromorphic computing architectures consisting in their homogeneous topologies, few building blocks and analog signal processing to be mapped to an inkjet-printed hardware architecture. It has remained a challenge to demonstrate non-linear elements besides weighted aggregation. We demonstrate in this work printed hardware building blocks such as inverter-based comprehensive weight representation and resistive crossbars as well as printed transistor-based activation functions. In addition, we present a learning algorithm developed to train the proposed printed NCS architecture based on specific requirements and constraints of the technology.
Effective medium theories (EMT) are powerful tools to calculate sample averaged thermoelectric material properties of composite materials. However, averaging over the heterogeneous spatial distribution of the phases can lead to incorrect estimates of the thermoelectric transport properties and the figure of merit ZT in compositions close to the percolation threshold. This is particularly true when the phases’ electronic properties are rather distinct leading to pronounced percolation effects. The authors propose an alternative model to calculate the thermoelectric properties of multi‐phased materials that are based on an expanded nodal analysis of random resistor networks (RRN). This method conserves the information about the morphology of the individual phases, allowing the study of the current paths through the phases and the influence of heterogeneous charge transport and cluster formation on the effective material properties of the composite. The authors show that in composites with strongly differing phases close to the percolation threshold the thermoelectric properties and the ZT value are always dominated exclusively by one phase or the other and never by an average of both. For these compositions, the individual samples display properties vastly different from EMT predictions and can be exploited for an increased thermoelectric performance.
A Hybrid Optoelectronic Sensor Platform with an Integrated Solution‐Processed Organic Photodiode
(2021)
Hybrid systems, unifying printed electronics with silicon‐based technology, can be seen as a driving force for future sensor development. Especially interesting are sensing elements based on printed devices in combination with silicon‐based high‐performance electronics for data acquisition and communication. In this work, a hybrid system integrating a solution‐processed organic photodiode in a silicon‐based system environment, which enables flexible device measurement and application‐driven development, is presented. For performance evaluation of the integrated organic photodiode, the measurements are compared to a silicon‐based counterpart. Therefore, the steady state response of the hybrid system is presented. Promising application scenarios are described, where a solution‐processed organic photodiode is fully integrated in a silicon system.