Refine
Year of publication
- 2020 (23) (remove)
Document Type
- Article (reviewed) (23) (remove)
Has Fulltext
- no (23) (remove)
Is part of the Bibliography
- yes (23)
Keywords
- 3D Strukturlichtscanner (1)
- Abbildungsqualität (1)
- Abguss der Hand (1)
- Antenna measurements (1)
- Antennas (1)
- Biomechanik (1)
- Cardiac Resynchronization Therapy (1)
- Cardiac modelling (1)
- Cochlea-Implantate (1)
- Durchlaufzeiten (1)
Institute
- Fakultät Elektrotechnik, Medizintechnik und Informatik (EMI) (ab 04/2019) (23) (remove)
Open Access
- Closed Access (15)
- Open Access (6)
Analysis of Miniaturized Printed Flexible RFID/NFC Antennas Using Different Carrier Substrates
(2020)
Antennas for Radio Frequency Identification (RFID) provide benefits for high frequencies (HF) and wireless data transmission via Near Field Communication (NFC) and many other applications. In this case, various requirements for the design of the reader and transmitter antennas must be met in order to achieve a suitable transmission quality. In this work, a miniaturized cost-effective RFID/NFC antenna for a microelectronic measurement system is designed and printed on different flexible carrier substrates using a new and low-cost Direct Ink Writing (DIW) technology. Various practical aspects such as reflection and impedance magnitude as well as the behavior of the printed RFID/NFC antennas are analyzed and compared to an identical copper-based antenna of the same size. The results are presented in this paper. Furthermore, the problems during the printing process itself on the different substrates are evaluated. The effects of the characteristics on the antenna under kink-free bending tests are examined and subsequently long-term measurements are carried out.
Diffracted waves carry high‐resolution information that can help interpreting fine structural details at a scale smaller than the seismic wavelength. However, the diffraction energy tends to be weak compared to the reflected energy and is also sensitive to inaccuracies in the migration velocity, making the identification of its signal challenging. In this work, we present an innovative workflow to automatically detect scattering points in the migration dip angle domain using deep learning. By taking advantage of the different kinematic properties of reflected and diffracted waves, we separate the two types of signals by migrating the seismic amplitudes to dip angle gathers using prestack depth imaging in the local angle domain. Convolutional neural networks are a class of deep learning algorithms able to learn to extract spatial information about the data in order to identify its characteristics. They have now become the method of choice to solve supervised pattern recognition problems. In this work, we use wave equation modelling to create a large and diversified dataset of synthetic examples to train a network into identifying the probable position of scattering objects in the subsurface. After giving an intuitive introduction to diffraction imaging and deep learning and discussing some of the pitfalls of the methods, we evaluate the trained network on field data and demonstrate the validity and good generalization performance of our algorithm. We successfully identify with a high‐accuracy and high‐resolution diffraction points, including those which have a low signal to noise and reflection ratio. We also show how our method allows us to quickly scan through high dimensional data consisting of several versions of a dataset migrated with a range of velocities to overcome the strong effect of incorrect migration velocity on the diffraction signal.
Extracting horizon surfaces from key reflections in a seismic image is an important step of the interpretation process. Interpreting a reflection surface in a geologically complex area is a difficult and time-consuming task, and it requires an understanding of the 3D subsurface geometry. Common methods to help automate the process are based on tracking waveforms in a local window around manual picks. Those approaches often fail when the wavelet character lacks lateral continuity or when reflections are truncated by faults. We have formulated horizon picking as a multiclass segmentation problem and solved it by supervised training of a 3D convolutional neural network. We design an efficient architecture to analyze the data over multiple scales while keeping memory and computational needs to a practical level. To allow for uncertainties in the exact location of the reflections, we use a probabilistic formulation to express the horizons position. By using a masked loss function, we give interpreters flexibility when picking the training data. Our method allows experts to interactively improve the results of the picking by fine training the network in the more complex areas. We also determine how our algorithm can be used to extend horizons to the prestack domain by following reflections across offsets planes, even in the presence of residual moveout. We validate our approach on two field data sets and show that it yields accurate results on nontrivial reflectivity while being trained from a workable amount of manually picked data. Initial training of the network takes approximately 1 h, and the fine training and prediction on a large seismic volume take a minute at most.
Printed electronics (PE) enables disruptive applications in wearables, smart sensors, and healthcare since it provides mechanical flexibility, low cost, and on-demand fabrication. The progress in PE raises trust issues in the supply chain and vulnerability to reverse engineering (RE) attacks. Recently, RE attacks on PE circuits have been successfully performed, pointing out the need for countermeasures against RE, such as camouflaging. In this article, we propose a printed camouflaged logic cell that can be inserted into PE circuits to thwart RE. The proposed cell is based on three components achieved by changing the fabrication process that exploits the additive manufacturing feature of PE. These components are optically look-alike, while their electrical behaviors are different, functioning as a transistor, short, and open. The properties of the proposed cell and standard PE cells are compared in terms of voltage swing, delay, power consumption, and area. Moreover, the proposed camouflaged cell is fabricated and characterized to prove its functionality. Furthermore, numerous camouflaged components are fabricated, and their (in)distinguishability is assessed to validate their optical similarities based on the recent RE attacks on PE. The results show that the proposed cell is a promising candidate to be utilized in camouflaging PE circuits with negligible overhead.
Printed electronics (PE) is a fast-growing field with promising applications in wearables, smart sensors, and smart cards, since it provides mechanical flexibility, and low-cost, on-demand, and customizable fabrication. To secure the operation of these applications, true random number generators (TRNGs) are required to generate unpredictable bits for cryptographic functions and padding. However, since the additive fabrication process of the PE circuits results in high intrinsic variations due to the random dispersion of the printed inks on the substrate, constructing a printed TRNG is challenging. In this article, we exploit the additive customizable fabrication feature of inkjet printing to design a TRNG based on electrolyte-gated field-effect transistors (EGFETs). We also propose a printed resistor tuning flow for the TRNG circuit to mitigate the overall process variation of the TRNG so that the generated bits are mostly based on the random noise in the circuit, providing a true random behavior. The simulation results show that the overall process variation of the TRNGs is mitigated by 110 times, and the generated bitstream of the tuned TRNGs passes the National Institute of Standards and Technology - Statistical Test Suite. For the proof of concept, the proposed TRNG circuit was fabricated and tuned. The characterization results of the tuned TRNGs prove that the TRNGs generate random bitstreams at the supply voltage of down to 0.5 V. Hence, the proposed TRNG design is suitable to secure low-power applications in this domain.
Printed Electronics technology is a key-enabler for smart sensors, soft robotics, and wearables. The inkjet printed electrolyte-gated field effect transistor (EGFET) technology is a promising candidate for such applications due to its low-power operation, high field-effect mobility, and on-demand fabrication. Unlike conventional silicon-based technologies, inkjet printed electronics technology is an additive manufacturing process where multiple layers are printed on top of each other to realize functional devices such as transistors and their interconnections. Due to the additive manufacturing process, the technology has limited routing layers. For routing of complex circuits, insulating crossovers are printed at the intersection of routing paths to isolate them. The crossover can alter the electrical properties of a circuit based on specific location on a routing path. In this work, we propose a crossover-aware placement and routing (COPnR) methodology for inkjet-printed circuits by integrating the crossover constraints in our design framework. Our proposed placement methodology is based on a state-of-the-art evolutionary algorithm while the routing optimization is done using a genetic algorithm. The proposed methodology is compared with the industrial standard placement and routing (PnR) tools. On average, the proposed methodology has 38% fewer crossovers and 94% fewer failing paths compared to the industrial PnR tools applied to printed circuit designs.
Advances in printed electronics (PE) enables new applications, particularly in ultra-low-cost domains. However, achieving high-throughput printing processes and manufacturing yield is one of the major challenges in the large-scale integration of PE technology. In this article, we present a programmable printed circuit based on an efficient printed lookup table (pLUT) to address these challenges by combining the advantages of the high-throughput advanced printing and maskless point-of-use final configuration printing. We propose a novel pLUT design which is more efficient in PE realization compared to existing LUT designs. The proposed pLUT design is simulated, fabricated, and programmed as different logic functions with inkjet printed conductive ink to prove that it can realize digital circuit functionality with the use of programmability features. The measurements show that the fabricated LUT design is operable at 1 V.
High-performance Ag–Se-based n-type printed thermoelectric (TE) materials suitable for room-temperature applications have been developed through a new and facile synthesis approach. A high magnitude of the Seebeck coefficient up to 220 μV K–1 and a TE power factor larger than 500 μW m–1 K–2 for an n-type printed film are achieved. A high figure-of-merit ZT ∼0.6 for a printed material has been found in the film with a low in-plane thermal conductivity κF of ∼0.30 W m–1 K–1. Using this material for n-type legs, a flexible folded TE generator (flexTEG) of 13 thermocouples has been fabricated. The open-circuit voltage of the flexTEG for temperature differences of ΔT = 30 and 110 K is found to be 71.1 and 181.4 mV, respectively. Consequently, very high maximum output power densities pmax of 6.6 and 321 μW cm–2 are estimated for the temperature difference of ΔT = 30 K and ΔT = 110 K, respectively. The flexTEG has been demonstrated by wearing it on the lower wrist, which resulted in an output voltage of ∼72.2 mV for ΔT ≈ 30 K. Our results pave the way for widespread use in wearable devices.
Morphological transition of a rod-shaped phase into a string of spherical particles is commonly observed in the microstructures of alloys during solidification (Ratke and Mueller, 2006). This transition phenomenon can be explained by the classic Plateau-Rayleigh theory which was derived for fluid jets based on the surface area minimization principle. The quintessential work of Plateau-Rayleigh considers tiny perturbations (amplitude much less than the radius) to the continuous phase and for large amplitude perturbations, the breakup condition for the rod-shaped phase is still a knotty issue. Here, we present a concise thermodynamic model based on the surface area minimization principle as well as a non-linear stability analysis to generalize Plateau-Rayleigh’s criterion for finite amplitude perturbations. Our results demonstrate a breakup transition from a continuous phase via dispersed particles towards a uniform-radius cylinder, which has not been found previously, but is observed in our phase-field simulations. This new observation is attributed to a geometric constraint, which was overlooked in former studies. We anticipate that our results can provide further insights on microstructures with spherical particles and cylinder-shaped phases.
Amorphous In-Ga-Zn-O (IGZO) is a high-mobility semiconductor employed in modern thin-film transistors for displays and it is considered as a promising material for Schottky diode-based rectifiers. Properties of the electronic components based on IGZO strongly depend on the manufacturing parameters such as the oxygen partial pressure during IGZO sputtering and post-deposition thermal annealing. In this study, we investigate the combined effect of sputtering conditions of amorphous IGZO (In:Ga:Zn=1:1:1) and post-deposition thermal annealing on the properties of vertical thin-film Pt-IGZO-Cu Schottky diodes, and evaluated the applicability of the fabricated Schottky diodes for low-frequency half-wave rectifier circuits. The change of the oxygen content in the gas mixture from 1.64% to 6.25%, and post-deposition annealing is shown to increase the current rectification ratio from 10 5 to 10 7 at ±1 V, Schottky barrier height from 0.64 eV to 0.75 eV, and the ideality factor from 1.11 to 1.39. Half-wave rectifier circuits based on the fabricated Schottky diodes were simulated using parameters extracted from measured current-voltage and capacitance-voltage characteristics. The half-wave rectifier circuits were realized at 100 kHz and 300 kHz on as-fabricated Schottky diodes with active area of 200 μm × 200 μm, which is relevant for the near-field communication (125 kHz - 134 kHz), and provided the output voltage amplitude of 0.87 V for 2 V supply voltage. The simulation results matched with the measurement data, verifying the model accuracy for circuit level simulation.