Refine
Year of publication
Document Type
- Conference Proceeding (59) (remove)
Conference Type
- Konferenzband (54)
- Konferenzartikel (5)
Is part of the Bibliography
- no (59) (remove)
Keywords
- Mikroelektronik (54)
- Design automation (3)
- FETs (2)
- Finite difference methods (2)
- Frequency (2)
- Integrated circuit interconnections (2)
- Microwave devices (2)
- Semiconductor device packaging (2)
- Closed-form solution (1)
- Couplers (1)
- Couplings (1)
- Differential equations (1)
- Energy storage (1)
- Equivalent circuits (1)
- Filters (1)
- Finite-Differenzen-Methode (1)
- Finite-Elemente-Methode (1)
- Gratings (1)
- Joining processes (1)
- Microwave integrated circuits (1)
- Microwave integrated circuits Equivalent circuits (1)
- Propagation losses (1)
- Resonatorfilter (1)
- Transducers (1)
Institute
- Fakultät Elektrotechnik und Informationstechnik (E+I) (bis 03/2019) (59) (remove)
Open Access
- Bronze (54)
- Open Access (54)
- Closed (5)
The advantages of the coupling-of-modes (COM) formalism and the transmission-matrix approach are combined to create exact and computationally efficient analysis and synthesis CAD tools for the design of SAW-resonator filters. The models for the filter components, especially gratings, interdigital transducers (IDTs). and multistrip couplers (MSCs), are based on the COM approach, which delivers closed-form expressions. In order to determine the relevant COM parameters, the integrated COM differential equations are compared with analytically derived expressions from the transmission-matrix approach. The most important second-order effects such as energy storage, propagation loss and mechanical and electrical loading are fully taken into account. As an example, the authors investigate a two-pole, acoustically coupled resonator filter at 914.5 MHz on AT quartz. Excellent agreement between theory and measurement is found.
Structures for interconnecting active microwave semiconductor-devices, e.g. FET's and MIC's, with the electrical surrounding or with each other have to be designed more and more carefully when increasing the desired upper frequency limit. Therefore, several connecting structures for device embedding have been examined. Mainly, their applicability for the frequency range from 10 GHz to 100 GHz was considered. Additionally, different equivalent circuits were developed to approximately describe their behaviour for CAD-applications.
MPC-Workshop Juli 2018
(2018)
MPC-Workshop Februar 2016
(2016)
MPC-Workshop Juli 2015
(2015)
MPC-Workshop Februar 2015
(2015)
MPC-Workshop Juli 2014
(2014)
MPC-Workshop Februar 2014
(2014)
MPC-Workshop Juli 2013
(2013)
MPC-Workshop Februar 2013
(2013)
MPC-Workshop Juli 2012
(2012)
MPC-Workshop Februar 2012
(2012)
MPC-Workshop Juli 2011
(2011)
MPC-Workshop Februar 2011
(2011)
Tagungsband zum Workshop der Multiprojekt-Chip-Gruppe Baden-Württemberg, Reutlingen, 9. Juli 2010
(2010)
Tagungsband zum Workshop der Multiprojekt-Chip-Gruppe Baden-Württemberg, Göppingen, 5. Februar 2010
(2010)
Tagungsband zum Workshop der Multiprojekt-Chip-Gruppe Baden-Württemberg, Karlsruhe, 10. Juli 2009
(2009)
Tagungsband zum Workshop der Multiprojekt-Chip-Gruppe Baden-Württemberg, Künzelsau, 6. Februar 2009
(2009)
Tagungsband zum Workshop der Multiprojekt-Chip-Gruppe Baden-Württemberg, Konstanz, 4. Juli 2008
(2008)
MPC-Workshop Juli 2007
(2007)
MPC-Workshop Februar 2007
(2007)
MPC-Workshop Juli 2006
(2006)
MPC-Workshop Februar 2006
(2006)
MPC-Workshop Juli 2005
(2005)
MPC-Workshop Februar 2005
(2005)
MPC-Workshop Juli 2004
(2004)
MPC-Workshop Februar 2004
(2004)
MPC-Workshop Juli 2003
(2003)
MPC-Workshop Januar 2003
(2003)
MPC-Workshop Juni 2002
(2002)
MPC-Workshop Januar 2002
(2002)
MPC-Workshop Juli 2001
(2001)
MPC-Workshop Februar 2001
(2001)