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Electrolyte-gated, printed field-effect transistors exhibit high charge carrier densities in the channel and thus high on-currents at low operating voltages, allowing for the low-power operation of such devices. This behavior is due to the high area-specific capacitance of the device, in which the electrolyte takes the role of the dielectric layer of classical architectures. In this paper, we investigate intrinsic double-layer capacitances of ink-jet printed electrolyte-gated inorganic field-effect transistors in both in-plane and top-gate architectures by means of voltage-dependent impedance spectroscopy. By comparison with deembedding structures, we separate the intrinsic properties of the double-layer capacitance at the transistor channel from parasitic effects and deduce accurate estimates for the double-layer capacitance based on an equivalent circuit fitting. Based on these results, we have performed simulations of the electrolyte cutoff frequency as a function of electrolyte and gate resistances, showing that the top-gate architecture has the potential to reach the kilohertz regime with proper optimization of materials and printing process. Our findings additionally enable accurate modeling of the frequency-dependent capacitance of electrolyte/ion gel-gated devices as required in the small-signal analysis in the circuit simulation.
Printed electronics (PE) is a fast growing technology with promising applications in wearables, smart sensors and smart cards since it provides mechanical flexibility, low-cost, on-demand and customizable fabrication. To secure the operation of these applications, True Random Number Generators (TRNGs) are required to generate unpredictable bits for cryptographic functions and padding. However, since the additive fabrication process of PE circuits results in high intrinsic variation due to the random dispersion of the printed inks on the substrate, constructing a printed TRNG is challenging. In this paper, we exploit the additive customizable fabrication feature of inkjet printing to design a TRNG based on electrolyte-gated field effect transistors (EGFETs). The proposed memory-based TRNG circuit can operate at low voltages (≤ 1 V ), it is hence suitable for low-power applications. We also propose a flow which tunes the printed resistors of the TRNG circuit to mitigate the overall process variation of the TRNG so that the generated bits are mostly based on the random noise in the circuit, providing a true random behaviour. The results show that the overall process variation of the TRNGs is mitigated by 110 times, and the simulated TRNGs pass the National Institute of Standards and Technology Statistical Test Suite.
Printed Electronics is perceived to have a major impact in the fields of smart sensors, Internet of Things and wearables. Especially low power printed technologies such as electrolyte gated field effect transistors (EGFETs) using solution-processed inorganic materials and inkjet printing are very promising in such application domains. In this paper, we discuss a modeling approach to describe the variations of printed devices. Incorporating these models and design flows into our previously developed printed design system allows for robust circuit design. Additionally, we propose a reliability-aware routing solution for printed electronics technology based on the technology constraints in printing crossovers. The proposed methodology was validated on multiple benchmark circuits and can be easily integrated with the design automation tools-set.
In the domain of printed electronics (PE), field-effect transistors (FETs) with an oxide semiconductor channel are very promising. In particular, the use of high gate-capacitance of the composite solid polymer electrolytes (CSPEs) as a gate-insulator ensures extremely low voltage requirements. Besides high gate capacitance, such CSPEs are proven to be easily printable, stable in air over wide temperature ranges, and possess high ion conductivity. These CSPEs can be sensitive to moisture, especially for high surface-to-volume ratio printed thin films. In this paper, we provide a comprehensive experimental study on the effect of humidity on CSPE-gated single transistors. At the circuit level, the performance of ring oscillators (ROs) has been compared for various humidity conditions. The experimental results of the electrolyte-gated FETs (EGFETs) demonstrate rather comparable currents between 30%-90% humidity levels. However, the shifted transistor parameters lead to a significant performance change of the RO frequency behavior. The study in this paper shows the need of an impermeable encapsulation for the CSPE-gated FETs to ensure identical performance at all humidity conditions.
In many application domains, in particular automotives, guaranteeing a very low failure rate is crucial to meet functional and safety standards. Especially, reliable operation of memory components such as SRAM cells is of essential importance. Due to aggressive technology downscaling, process and runtime variations significantly impact manufacturing yield as well as functionality. For this reason, a thorough memory failure rate assessment is imperative for correct circuit operation and yield improvement. In this regard, Monte Carlo simulations have been used as the conventional method to estimate the variability induced failure rate of memory components. However, Monte Carlo methods become infeasible when estimating rare events such as high-sigma failure rates. To this end, Importance Sampling methods have been proposed which reduce the number of required simulations substantially. However, existing methods still suffer from inaccuracies and high computational efforts, in particular for high-sigma problems. In this paper, we fill this gap by presenting an efficient mixture Importance Sampling approach based on Bayesian optimization, which deploys a surface model of the objective function to find the most probable failure points. Its advantages include constant complexity independent of the dimensions of design space, the potential to find the global extrema, and higher trustworthiness of the estimated failure rate by accurately exploring the design space. The approach is evaluated on a 6T-SRAM cell as well as a master-slave latch based on a 28nm FDSOI process. The results show an improvement in accuracy, resulting in up to 63× better accuracy in estimating failure rates compared to the best state-of-the-art solutions on a 28nm technology node.