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Field-Theoretical Analysis of MIC Packaging Structures with a Three-Dimensional Finite-Difference Method and Modelling by Equivalent Circuits for CAD Application

  • Structures for interconnecting active microwave semiconductor-devices, e.g. FET's and MIC's, with the electrical surrounding or with each other have to be designed more and more carefully when increasing the desired upper frequency limit. Therefore, several connecting structures for device embedding have been examined. Mainly, their applicability for the frequency range from 10 GHz to 100 GHz wasStructures for interconnecting active microwave semiconductor-devices, e.g. FET's and MIC's, with the electrical surrounding or with each other have to be designed more and more carefully when increasing the desired upper frequency limit. Therefore, several connecting structures for device embedding have been examined. Mainly, their applicability for the frequency range from 10 GHz to 100 GHz was considered. Additionally, different equivalent circuits were developed to approximately describe their behaviour for CAD-applications.show moreshow less

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Metadaten
Document Type:Conference Proceeding
Title (English):Field-Theoretical Analysis of MIC Packaging Structures with a Three-Dimensional Finite-Difference Method and Modelling by Equivalent Circuits for CAD Application
Author:Andreas ChristORCiDGND, Hans L. Hartnagel
Year of Publication:1987
Publisher:IEEE
First Page:647
Last Page:652
Parent Title (English):17th European Microwave Conference
DOI:https://doi.org/10.1109/EUMA.1987.333680
URL:https://ieeexplore.ieee.org/document/4132414
Language:English
Institutes:Fakultät Elektrotechnik und Informationstechnik (E+I) (bis 03/2019)
GND Keyword:Finite-Elemente-Methode
Tag:Design automation; Equivalent circuits; FETs; Finite difference methods; Frequency; Integrated circuit interconnections; Joining processes; Microwave devices; Microwave integrated circuits; Semiconductor device packaging
Open Access: Closed 
Licence (German):License LogoUrheberrechtlich geschützt
Comment:
Konferenz: 17th European Microwave Conference, September 1987, Ergife Palace Hotel, Rome, Italy