Field-Theoretical Analysis of MIC Packaging Structures with a Three-Dimensional Finite-Difference Method and Modelling by Equivalent Circuits for CAD Application
- Structures for interconnecting active microwave semiconductor-devices, e.g. FET's and MIC's, with the electrical surrounding or with each other have to be designed more and more carefully when increasing the desired upper frequency limit. Therefore, several connecting structures for device embedding have been examined. Mainly, their applicability for the frequency range from 10 GHz to 100 GHz wasStructures for interconnecting active microwave semiconductor-devices, e.g. FET's and MIC's, with the electrical surrounding or with each other have to be designed more and more carefully when increasing the desired upper frequency limit. Therefore, several connecting structures for device embedding have been examined. Mainly, their applicability for the frequency range from 10 GHz to 100 GHz was considered. Additionally, different equivalent circuits were developed to approximately describe their behaviour for CAD-applications.…
| Dokumentart: | Konferenzveröffentlichung |
|---|---|
| Art der Konferenzveröffentlichung: | Konferenzartikel |
| Zitierlink: | https://opus.hs-offenburg.de/6102 | Bibliografische Angaben |
| Titel (Englisch): | Field-Theoretical Analysis of MIC Packaging Structures with a Three-Dimensional Finite-Difference Method and Modelling by Equivalent Circuits for CAD Application |
| Konferenzangaben: | European Microwave Conference (17. : September 1987 : Ergife Palace Hotel, Rome, Italy) |
| Verfasserangaben: | Andreas Christ ORCiDGND, Hans L. Hartnagel |
| Erscheinungsjahr: | 1987 |
| Verlag: | IEEE |
| Erste Seite: | 647 |
| Letzte Seite: | 652 |
| Titel des übergeordneten Werkes (Englisch): | 17th European Microwave Conference |
| DOI: | https://doi.org/10.1109/EUMA.1987.333680 |
| URL: | https://ieeexplore.ieee.org/document/4132414 |
| Sprache: | Englisch | Inhaltliche Informationen |
| Fakultäten / Einrichtungen: | Veröffentlichungen außerhalb der Hochschulzeit |
| Freies Schlagwort / Tag: | Finite-Elemente-Methode Design automation; Equivalent circuits; FETs; Finite difference methods; Frequency; Integrated circuit interconnections; Joining processes; Microwave devices; Microwave integrated circuits; Semiconductor device packaging | Formale Angaben |
| Open-Access-Status: | Closed |
| Lizenz (Deutsch): |  Urheberrechtlich geschützt |